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INM-W Series: Elliptical Fin BGA HeatsinksRemovable Heatsinks for BGA Chipsets
Elliptical Fin BGA Heatsinks with Clip | |
High efficiency elliptical fin heatsinks for BGAs and other surface mount packages
Elliptical Fin design provides low pressure-drop characteristics for superior cooling performance in a series application
Ideally suited for swirling air flow environments or applications where multiple heatsinks are used in a row
Large fin surface area ensures optimum heat transfer
Removable BGA Clip ensures easy installation, with no additional board modifications or mounting accessories needed |
Standard Features
Pin Shape: Round Pin Product Material: Copper Product Finish: Clear Anodized
Attachment Options
Interface Pad: Chomerics T710 Pad Clip Material: Plastic (UL94-V0) Clip Options: Yellow, Blue or Orange BGA Clip
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