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INM-P Series: Round Pin BGA HeatsinksRemovable Heatsinks for BGA Chipsets
Round Pin BGA Heatsinks with Clip | |
High efficiency round pin heatsinks for BGA chips and other surface mount packages
Round Pin designs allow omni-directional airflow to maximize heat dissipation
Optional EZ Snapª BGA Clip ensures easy installation, with no additional board modifications or mounting accessories needed |
Standard Features
Fin Shape: Round Pin Product Material: Aluminum 6063 Product Finish: Black Anodized Plating
Attachment Options
Interface Pad: Chomerics T710 Pad Clip Material: Plastic (UL94-V0) Clip Options: Yellow, Blue or Orange BGA Clip
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