Support: Thermal FAQs
Q: Why and how do I determine if
I should design with a round pin or a plate (straight) fin?
A: In natural convection ( no forced air flow )
there is little difference. However in forced air environments round pins
generally perform 15% better than plate fins. The primary reasons for this
is that round fins exhibit lower pressure drops and are not affected by
boundary layer conditions common with straight fin designs. Round pins are
used when ever the moving air is omnidirectional or the heatsink will be
used in systems that the airflow direction is not known.
Q: What difference does the color of the heatsink make?
A: In natural convection a black or dark colored
heatsink will perform 3% to 8% better than an aluminum heatsink in its natural
silverish color. This is due to the fact that dark colors radiate heat more
efficiently. In forced air applications the color does not add any performance
due to the increase in convection.
Q: What surface treatment should be applied to heatsinks?
A: Many heatsinks are black or color anodized.
This is because of two reasons. 1.) It allows for the dark color to enhance
the radiation effects and 2.) It protects the aluminum in harsh environments.
Salt exposure is a good example. It is unnecessary in most electronic applications
other than natural convection. Gold or yellow chromate is also used to provide
surface protection. It adds little or no radiation benefits. Unfinished
aluminum is typically used in most consumer applications where thermal radiation
and harsh environments are not factors.
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Support: BGA Heatsinks
 Attachment
Options for BGA Heatsinks:
Our standard BGA heatsink assemblies are provided pre-assembled, with black
anodized aluminum heatsink and Chomerics T405 thermal interface pad (for
metal or ceramic packages). Additional attachment options include: EZ Snap™
Clips for various package sizes, Chomerics T710 pad (phase change material),
and Chomerics T410 pad (for plastic packages). Orders for clip assemblies
automatically include the Chomerics T710 pad.
For additional information on available BGA heatsink attachments, please
review our Attachment
Options Guide.
EZ
Snap™ Mounting Guide
For instructions on installing and removing your EZ Snap™ Clips, please
review our EZ
Snap™ Mounting Guide.
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Support: DC/DC Heatsinks
Attachment
Options for DC/DC Heatsinks:
Our standard DC/DC heatsinks are provided pre-assembled, with black anodized
aluminum heatsink, and any attachment options you select to purchase. Additional
attachment options include: Furon C695 Graphite Tape (non-adhesive), 4mm
Mounting Screws, and 8mm Mounting Screws (all mounting screws are provided
in sets of 4 per heatsink).
Hole-to-Hole
Dimensions:
Our DC/DC heatsinks are designed to fit most DC manufacturers. To ensure
compatibility with your specific DC Manufacturer, please check hole-to-hole
dimensions prior to purchasing a DC/DC Converter heatsink:
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Support: Thermal Tape - T710
Engineering Bulletin :
Chomeric T710 Tape manual announcement.
We recently received a technical notification from Chomerics concerning T710 Phase Change material storage requirements. To avoid degredation of the Phase Change materials please follow the below:
1.) Chomerics recommends maintaining a storage a maximum temperature of 25℃(77 F). Temperatures greater than 25 C may result in deformed material.
2.) If material is stored at temperatures above 25C – 1 hour before installation open the carton(s), unpackage each tray and place them in an air-conditioned room. Make sure the material is at or below 25 C before handling the material.
3.) The above procedure will help to insure the integrity of the product.
Contact Us:
Radian Heatsinks
Radian
Store Product Support
toll-free: 800.689.2802
tel: 408.988.6200
fax: 408.988.0683
customer service: customerservice@radianheatsinks.com
sales: sales@radianheatsinks.com
web site inquiries: webmaster@radianstore.com
For more information, visit: www.radianheatsinks.com
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